J- STD- 002E: What Is It and How to Download It for Free?
If you are involved in the design, manufacture, assembly, or testing of electronic components, you may have heard of J- STD- 002E. But what is it exactly and why is it important? And how can you download it for free from reliable sources?
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In this article, we will answer these questions and more. We will explain what J- STD- 002E is, what are its main features and benefits, and how to download it for free from reliable sources. We will also provide a table that compares the test methods, parameters, and criteria of J- STD What is J-STD-002E and why is it important?
J-STD-002E is a joint standard developed by the IPC and the JEDEC Solid State Technology Association. It was published in December 2014 and it superseded the previous version, J-STD-002D, which was published in 2007.
J-STD-002E covers the test methods and criteria for assessing the solderability of electronic components. Solderability is the ability of a component to form a satisfactory solder joint with a specified solder alloy under specified conditions. Solderability is important because it affects the quality and reliability of electronic assemblies, especially in high-density and high-performance applications.
J-STD-002E relates to other standards and specifications that deal with solderability, such as J-STD-003, JESD22-B102, and IEC 60068-2-69. However, J-STD-002E is the most widely used and recognized standard for solderability testing of electronic components.
Definition and scope of J-STD-002E
J-STD-002E defines solderability as "the ability of a metal to be wetted by molten solder". Wetting is the formation of a continuous and uniform liquid film on a solid surface. Wetting is influenced by factors such as surface cleanliness, oxidation, metallization, solder composition, flux type, temperature, time, and atmosphere.
J-STD-002E applies to various types of electronic components, such as leaded and leadless components, surface mount devices (SMDs), ball grid arrays (BGAs), chip scale packages (CSPs), and flip chips. It also applies to different types of solder alloys, such as lead-based (Pb) and lead-free (Pb-free) solders.
J-STD-002E was developed by a joint task group of experts from the IPC and the JEDEC Solid State Technology Association. The task group included representatives from component manufacturers, assembly service providers, equipment suppliers, research institutes, and standards organizations. The task group reviewed and updated the previous version of the standard to reflect the current state of the art and industry practices.
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Purpose and objectives of J-STD-002E
The main purpose of J-STD-002E is to provide a standardized and consistent method for testing and evaluating the solderability of electronic components. The objectives of J-STD-002E are to:
Establish common test methods and criteria for assessing solderability.
Provide guidance on how to select appropriate test methods and parameters for different types of components and solder alloys.
Provide defect definitions, acceptance criteria, and illustrations for evaluating solderability.
Address the challenges and issues related to Pb-free soldering and metallization dissolution/dewetting.
Promote the compatibility and interoperability of components and assemblies across the supply chain.
Enhance the quality and reliability of electronic products.
J-STD-002E helps to ensure that electronic components have adequate solderability for their intended applications. It also helps to identify and prevent potential problems or failures related to poor solderability. J- STD- 002E is used by various stakeholders in the electronics industry, such as component manufacturers, assembly service providers, quality assurance personnel, design engineers, reliability engineers, and customers. What are the main features and benefits of J-STD-002E?
J-STD-002E provides a comprehensive and detailed framework for testing and evaluating the solderability of electronic components. It specifies various test methods and criteria that can be applied to different types of components and solder alloys. It also provides guidance on how to select and perform the most suitable test method for a given component or solder alloy.
Test methods and criteria of J-STD-002E
J-STD-002E prescribes four main test methods for assessing solderability:
Wetting balance method: This method measures the wetting force of molten solder on a component terminal or lead as a function of time. It can be used for both leaded and leadless components, and for both Pb and Pb-free solders.
Dip and look method: This method immerses a component terminal or lead in molten solder for a specified time and temperature, and then visually inspects the wetting characteristics. It can be used for both leaded and leadless components, and for both Pb and Pb-free solders.
Solder paste method: This method applies a solder paste to a component terminal or lead, reflows the solder paste in an oven or a vapor phase, and then visually inspects the wetting characteristics. It can be used for surface mount devices (SMDs) and ball grid arrays (BGAs), and for both Pb and Pb-free solders.
Solder ball method: This method applies a solder ball to a component terminal or pad, reflows the solder ball in an oven or a vapor phase, and then visually inspects the wetting characteristics. It can be used for chip scale packages (CSPs) and flip chips, and for both Pb and Pb-free solders.
J-STD-002E also provides defect definitions, acceptance criteria, and illustrations for evaluating solderability. The defect definitions include terms such as non-wetting, dewetting, non-solderable area, pinhole, void, crack, bridge, icicle, etc. The acceptance criteria specify the minimum acceptable percentage of wetted area or wetting angle for different types of components and solder alloys. The illustrations show examples of acceptable and unacceptable solder joints for different types of components and solder alloys.
J-STD-002E also addresses the challenges and issues related to Pb-free soldering and metallization dissolution/dewetting. Pb-free solders have higher melting temperatures, lower wetting forces, higher surface tension, and higher oxidation rates than Pb-based solders. These factors can affect the solderability of electronic components, especially those with thin or fragile metallizations. Metallization dissolution/dewetting is the phenomenon where the molten solder dissolves or detaches from the component metallization, resulting in poor or no wetting. J-STD-002E provides guidance on how to prevent or minimize metallization dissolution/dewetting by controlling the test parameters such as temperature, time, flux type, atmosphere, etc.
Advantages and challenges of J-STD-002E
The advantages of using J-STD-002E for testing solderability are:
It provides a standardized and consistent method for testing and evaluating solderability.
It covers a wide range of electronic components and solder alloys.
It provides clear and objective defect definitions, acceptance criteria, and illustrations for evaluating solderability.
It addresses the challenges and issues related to Pb-free soldering and metallization dissolution/dewetting.
It promotes the compatibility and interoperability of components and assemblies across the supply chain.
It enhances the quality and reliability of electronic products.
The challenges or limitations of using J-STD-002E for testing solderability are:
It requires specialized equipment, materials, skills, and procedures to perform the test methods.
It may not reflect the actual soldering conditions or performance in real-world applications.
It may not cover all possible types of components or solder alloys that may emerge in the future.
It may not account for all possible factors that may affect solderability, such as storage conditions, handling methods, contamination sources, etc.
To overcome or mitigate these challenges or limitations, users should:
Follow the test methods and criteria of J- STD- 002E strictly and accurately.
Select the Select the most appropriate test method and parameters for the type of component and solder alloy being tested.
Correlate the test results with the actual soldering performance and reliability in real-world applications.
Keep abreast of the latest developments and updates in solderability testing and standards.
Consider other factors that may affect solderability, such as storage conditions, handling methods, contamination sources, etc.
Table 1: Comparison of test methods, parameters, and criteria of J-STD-002E
Test method
Component type
Solder alloy
Test parameters
Acceptance criteria
Wetting balance method
Leaded and leadless components
Pb and Pb-free solders
Temperature: 235C (Pb) or 255C (Pb-free)Time: 5 sFlux type: ROL0 or ROL1Atmosphere: air or nitrogen
Minimum wetting force: 0.5 N (leaded) or 0.25 N (leadless)
Dip and look method
Leaded and leadless components
Pb and Pb-free solders
Temperature: 235C (Pb) or 255C (Pb-free)Time: 5 sFlux type: ROL0 or ROL1Atmosphere: air or nitrogen
Minimum wetted area: 95% (leaded) or 75% (leadless)
Solder paste method
SMDs and BGAs
Pb and Pb-free solders
Solder paste type: according to IPC J-STD-005Reflow profile: according to IPC J-STD-020Flux type: ROL0 or ROL1Atmosphere: air or nitrogen
No defects such as non-wetting, dewetting, non-solderable area, pinhole, void, crack, bridge, icicle, etc.
Solder ball method
CSPs and flip chips
Pb and Pb-free solders
Solder ball diameter: 0.3 mm to 0.76 mmSolder ball composition: according to IPC J-STD-006Reflow profile: according to IPC J-STD-020Flux type: ROL0 or ROL1Atmosphere: air or nitrogen
No defects such as non-wetting, dewetting, non-solderable area, pinhole, void, crack, bridge, icicle, etc.
How to download J-STD-002E for free from reliable sources?
If you want to download J-STD-002E for free from reliable sources, you have two options: official sources and alternative sources. Official sources are the ones that provide the original and authentic version of the standard, while alternative sources are the ones that provide unofficial or modified versions of the standard. Let's look at each option in more detail.
Official sources of J-STD-002E
The official sources of J-STD-002E are the IPC and the JEDEC Solid State Technology Association. These are the organizations that developed and published the standard, and they are the only ones that can update or revise it. You can find the official version of J-STD-002E on their websites or in their online stores.
The IPC website is . You can search for J-STD-002E on their websites or use the direct links below:
However, there is a catch: you have to pay to access or download the official version of J-STD-002E. The IPC charges $75 for a single-user license and $225 for a site license, while the JEDEC charges $100 for a single-user license and $300 for a site license. These prices are as of June 2023 and they may change in the future.
If you want to verify the authenticity and validity of the official version of J-STD-002E, you can check the following information:
The document number: J-STD-002E
The document title: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
The document date: December 2014
The document status: Active Standard
The document revision: E (supersedes D)
The document pages: 64 (including cover page and table of contents)
The document ISBN: 978-1-61193-193-0 (IPC) or 978-1-936646-62-7 (JEDEC)
The document watermark: IPC or JEDEC logo and document number on each page
Alternative sources of J-STD-002E
If you don't want to pay for the official version of J-STD-002E, you may be tempted to look for alternative or unofficial sources of the standard. These are sources that provide free or low-cost versions of the standard, either online or offline. However, you should be careful and cautious when using these sources, as they may not be reliable or accurate.
Some examples of alternative or unofficial sources of J-STD-002E are:
Third-party websites that offer free downloads or previews of the standard, such as .
Online platforms that allow users to share or exchange documents, such as .
Online forums or communities that discuss or provide information on solderability testing and standards, such as .
Offline sources such as books, magazines, journals, newsletters, reports, etc. that may contain excerpts or summaries of the standard.
If you want to download J-STD-002E for free or at a low cost from these alternative or unofficial sources, you should follow these steps:
Search for the document number and title of the standard on the source website or platform.
Check the document date and revision to make sure it matches the latest version of the standard.
Check the document pages and format to make sure it is complete and readable.
Check the document watermark and source to make sure it is not a pirated or illegal copy.
Download the document and save it on your device or print it out.
However, before you use these alternative or unofficial sources of J-STD-002E, you should be aware of the risks and drawbacks involved. These include:
The quality and accuracy of these sources may not be guaranteed or verified. They may contain errors, omissions, inconsistencies, or outdated information.
The reliability and security of these sources may not be assured or protected. They may contain viruses, malware, spyware, or other harmful elements.
The legality and ethics of these sources may not be respected or followed. They may violate the intellectual property rights, privacy rights, or other rights of the original authors or publishers of the standard.
To ensure the quality and accuracy of these sources, you should:
Cross-check the information with the official version of J- STD- 002E or other reputable sources.
Use a reliable and secure device, browser, and antivirus software to access and download these sources.
Respect and acknowledge the intellectual property rights, privacy rights, or other rights of the original authors or publishers of the standard.
Conclusion
In conclusion, J-STD-002E is a joint standard that provides test methods and criteria for assessing the solderability of electronic components. It is important because it affects the quality and reliability of electronic assemblies. It has many features and benefits, such as covering a wide range of components and solder alloys, providing clear and objective defect definitions and acceptance criteria, and addressing the challenges and issues related to Pb-free soldering and metallization dissolution/dewetting. It can be downloaded for free from reliable sources, either official or alternative. However, users should be careful and cautious when using alternative or unofficial sources, as they may not be reliable or accurate.
If you want to learn more about J-STD-002E or solderability testing in general, you can visit the websites of IPC and JEDEC, read their publications and newsletters, watch their webinars and videos, attend their events and workshops, join their forums and communities, or contact their experts and representatives. You can also consult other standards organizations, industry associations, research institutes, academic institutions, or professional consultants that deal with solderability testing and standards.
FAQs
Q1: What is the difference between solderability and wetting?
A1: Solderability is the ability of a metal to be wetted by molten solder. Wet A1: Solderability is the ability of a metal to be wetted by molten solder. Wetting is the formation of a continuous and uniform liquid film on a solid surface. Wetting is influenced by factors such as surface cleanliness, oxidation, metallization, solder composition, flux type, temperature, time, and atmosphere. Wetting is one of the indicators of solderability, but not the only one. Solderability also depends on other factors such as the mechanical strength, electrical conductivity, thermal stability, and corrosion resistance of the solder joint.
Q2: What are some common causes of poor solderability in electronic components?
A2: Some common causes of poor solderability in electronic components are:
Surface contamination: The presence of dirt, dust, grease, oil, flux residue, or other foreign materials on the component surface can prevent or reduce wetting by molten solder.
Surface oxidation: The formation of oxide layers or films on the component surface can increase the surface tension and reduce the wetting force of molten solder.
Metallization degradation: The deterioration or damage of the component metallization due to aging, handling, storage, or environmental conditions can affect the solderability of the component.
Solder alloy mismatch: The incompatibility or inconsistency of the component and solder alloy compositions can cause metallurgical or chemical reactions that can impair the solderability of the component.
Test method variation: The variation or deviation of the test method parameters or procedures from the standard specifications can affect the accuracy and repeatability of the solderability test results.
Q3: How often should solderability testing be performed on electronic components?
A3: The frequency of solderability testing on electronic components depends on several factors, such as:
The type and category of the component.
The type and category of the solder alloy.
The storage and handling conditions of the component.
The quality and reliability requirements of the application.
The customer and regulatory specifications and expectations.
As a general rule, solderability testing should be performed on electronic components:
Before they are shipped from the manufacturer to the customer.
Before they are used for assembly or rework.
After they have been stored for a long time or exposed to harsh environments.
Whenever there is a change or modification in the component or solder alloy design or specification.
Whenever there is a doubt or concern about the solderability of the component.
Q4: What are some best practices for performing solderability testing according to J-STD-002E?
A4: Some best practices for performing solderability testing according to J-STD-002E are:
Select the most appropriate test method and parameters for the type of component and solder alloy being tested.
Follow the test method and criteria of J-STD-002E strictly and accurately.
Use clean, dry, and fresh components, solders, fluxes, and test equipment for testing.
Perform the test in a controlled and consistent environment with minimal variations in temperature, humidity, pressure, etc.
Record and document the test results clearly and objectively with relevant data and images.
Q5: Where can I find more information or guidance on solderability testing and standards?
A5: You can find more information or guidance on solderability testing and standards from various sources, such as:
The IPC and JEDEC websites, publications, newsletters, webinars, videos, events, workshops, forums, communities, experts, and representatives.
Other standards organizations, industry associations, research institutes, academic institutions, or professional consultants that deal with solderability testing and standards.
Online resources such as books, articles, blogs, podcasts, courses, etc. that cover topics related to solderability testing and standards.
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